Date: 11 April 2024 Time: 15:00-17:00 Venue: 108 Conference Room Speaker: Dr. Benoit Derat Category: Talk & Lecture ABSTRACT: Trends in modern wireless communications, including the use of massive MIMO and millimeter wave frequencies, have supported an increased deployment of electrically large antennas. This created technical and economic challenges as many EMC or regulatory tests require a far-field condition. This talk provides an overview of the recent findings in defining the shortest possible far-field test distance, depending on the size of the device under test, its operation frequency, the target metric and the upper bound acceptable measurement deviation. Practical ways are also described to determine the maximum antenna aperture size that can be tested in the far-field at a given frequency and for a maximum error, in an existing chamber with a defined range length. BIO: Dr. Benoit Derat received the engineering degree from SUPELEC in 2002 and a Ph.D. degree in physics from University of Paris XI with honors in 2006. From 2002 to 2008, he worked at SAGEM Mobiles as an antenna design and electromagnetics research engineer. In 2009, he founded ART-Fi, which created the first vector-array Specific Absorption Rate measurement system. Dr. Derat operated as the CEO and President of ART-Fi, before joining Rohde & Schwarz in Munich in 2017. He is now working as Senior Director for Systems Developments and Project Implementations, covering Electromagnetic Compatibility, Over-The-Air, and antenna test applications. Dr. Derat is a Senior Member of the Antenna Measurement Techniques Association (AMTA) and the author of more than eighty scientific conference and journal papers, as well as an inventor on more than forty patents, with the main focus in antenna systems near- and far-field characterization techniques.
Date: 31 Mar. 2024 Time: 09:00-11:00 Venue: 108 Conference Room Speaker: Prof. John H Lau Category: Talk & Lecture Biography: John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 530 peer-reviewed papers (385 are the principal investigator), 52 issued and pending US patents (31 are the principal inventor), and 23 textbooks (all are the first author). John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share. Abstract：In this talk, we will discuss the status and trends of computational electromagnetic algorithms. Different methods be used to improve the speed and efficiency of simulation for different computational problems like ACA, CBFs, characteristic surface material, CMA, hybrid solver, high frequency solvers and HPC. Finally, New applications of electromagnetic computing in 5G/6G, RCS of complex target, etc will be shared. Ø Silicon Photonics Data Centers Optical Transceivers, Optical Engine (OE) and Electrical Engine (EE) OBO (on-board optics), NPO (near-board optics), CPO (co-packaged optics) Integration of the PIC and EIC 2D Heterogeneous Integration 3D Heterogeneous Integration of PIC and EIC 3D Heterogeneous Integration of ASIC Switch, PIC and EIC 3D Heterogeneous Integration of ASIC Switch, PIC and EIC with Bridges Heterogeneous Integration of ASIC Switch, PIC and EIC on Glass Substrate Summary
