题目：Advanced RF and SI Techniques in Wireless System�in�Packages

时间：2015年12月11日（星期五），上午10:00-12:00

地点：玉泉校区，行政楼111

报告人：Dr. Tzyy�Sheng Jason Horng

Brief Bio: Dr. Horng was was awarded with the 2011 Advanced Semiconductor Engineering (ASE) Inc. Chair Professorship and the 2012 Outstanding Research Award at the National Sun Yat�Sen University. Dr. Horng is the Founder Chair of the IEEE MTT�S Tainan Chapter, and currently an Associate Editor of the IEEE Transactions on Microwave Theory and Techniques, and a member of the IEEE MTT�S Technical Committee MTT�10 and MTT�20.

Abstract：System�in�package (SiP) technology is a key to miniaturization of wireless communication devices. The high�frequency research and development activities include RF integrated circuits, integrated passive devices, stacked�chips package structures, antennas and passives embedded in package substrate, broadband modeling of 3�D interconnects and RF system signal integrity.